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Effect of copper oxides on the thermal oxidative degradation of the epoxy resin
Author(s) -
Hong S. G.,
Wang T. C.
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070520918
Subject(s) - epoxy , thermogravimetric analysis , autocatalysis , fourier transform infrared spectroscopy , copper , degradation (telecommunications) , materials science , kinetics , catalysis , polymer chemistry , nuclear chemistry , chemistry , chemical engineering , composite material , organic chemistry , metallurgy , telecommunications , physics , quantum mechanics , computer science , engineering
The effect of copper oxides on the thermal oxidative degradation of a brominated epoxy resin–dicyandiamide system was studied using Fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA). The addition of small amounts of Cu 2 O or CuO fillers to the epoxy resins affected the relative amounts of highly reacted cyclic species formed during thermal aging and induced catalytic degradation of the epoxy resins. The overall and initial activation energies of the degradation process were found to decrease, and the order in the degradation kinetics of the epoxy resin changed from a near zero order to negative domain (autocatalytic nature) in the presence of copper oxides. © 1994 John Wiley & Sons, Inc.