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Thermal characteristics of silver powder‐filled polypropylene composites
Author(s) -
Maiti S. N.,
Ghosh K.
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070520810
Subject(s) - materials science , polypropylene , composite material , thermal expansion , filler (materials) , thermal stability , thermal conductivity , phase (matter) , activation energy , thermal , chemical engineering , chemistry , organic chemistry , engineering , physics , meteorology
The thermal properties of silver powder‐filled polypropylene composites were studied as a function of filler concentration. Thermal conductivities of the composites increased with filler content. Comparison of the data with theoretical predictive models for two‐phase systems showed that the Nielson equation agreed reasonably well with the measured values. A TGA study showed that presence of silver powder increased the thermal stability of polypropylene through an increase in activation energy. The thermal expansion coefficient of the composites exhibited a decreased in the presence of Ag powder. Surface treatment of Ag powder with a titanate coupling agent marginally increased thermal conductivity and decreased thermal expansion coefficient values, implying a degree of enhance adhesion of the filler with the polymer. © 1994 John Wiley & Sons, Inc.