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Modified lignosulfonate as adhesive
Author(s) -
Chen Rubie,
Wu Quoxiong
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070520309
Subject(s) - adhesive , urea formaldehyde , curing (chemistry) , formaldehyde , lignin , polymer chemistry , condensation polymer , ether , materials science , methylene , chemical engineering , chemistry , composite material , organic chemistry , polymer , layer (electronics) , engineering
Oxidized lignosulfonate (LS‐OB) displays a high crosslinking during thermal condensation. When LS‐OB was used as a partial substitute of urea‐formaldehyde (UF) in wood adhesive, a positive effect on the curing of resin could be observed. With 30–40% substitution, no deteriment in strength properties of particleboard was observed. Polycondensation of lignin and UF could occur between methylol groups in UF resin and hydroxyl and carbonyl groups in lignin, through ether bonds and methylene bridges. A high surface activity of LS‐OB would reduce the surface tension of binder solution and facilitate its distribution on wood particles, improving consequently the strength properties of particleboard. © 1994 John Wiley & Sons, Inc.