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Thermal analysis of silver coatings used for tantalum capacitors
Author(s) -
Ulrich M.,
Sarraf L.,
Loucheux C.
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070520304
Subject(s) - epoxy , materials science , thermal stability , polymer , tantalum , adhesive , composite material , thermal analysis , polyester , chemical engineering , thermal , metallurgy , layer (electronics) , physics , meteorology , engineering
Silver‐filled polymer coatings are used to ensure the cathodic junction of tantalum capacitors. To polimerize new materials able to resist to the RTSH industrial test, we studied first the physical chemistry of the main commercial coatings used at the present time. Four commercial silver coatings (epoxy, polyester, polyimid, and polyacrylate binders) and one conductive epoxy adhesive were tested. We separated the silver flakes from the polymer binder by centrifugation and filtration. We analyzed the thermal degradation and stability of the two kinds of sample (with the without silver flakes) using DSC and TGA. The influence of fillers mixing is discussed. This article reports, also, the main chemical structures of the binder components, determined using 1 H‐ and 13 C‐NMR and elemental analysis, after HPLC or GPC fractionation. © 1994 John Wiley & Sons, Inc.