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Positive photosensitive polyimides using polyamic acid esters with phenol moieties
Author(s) -
Hayase Rumiko,
Kihara Naoko,
Oyasato Naohiko,
Matake Shigeru,
Oba Masayuki
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070511113
Subject(s) - polyimide , phenol , dissolution , chemistry , aqueous solution , thermal stability , polymer chemistry , resist , substrate (aquarium) , organic chemistry , condensation polymer , polymer , layer (electronics) , oceanography , geology
Polyimide resists developable with basic aqueous solutions were realized by polyamic acid esters with phenol moieties (PPh's) and naphthoquinone diazides. The polyimide precursors (PPh's) were synthesized from diamines and dicarboxylic acids that have phenol moieties through ester linkage. A selective reaction of alcohol groups with acid dianhydride groups made the synthesis of the PPh's possible, even if the phenol groups were in the reaction mixtures. The PPh's were soluble in basic aqueous developer, but their dissolution rates were too low for use as resists. To increase the resist dissolution rate, polyamic acids were added to the PPh's. By adjusting the dissolution rates in basic aqueous developers, fine patterns could be realized. The polyimide resists had high thermal stability and reliable adhesive property to silicon substrate. © 1994 John Wiley & Sons, Inc.