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Studies on the thermal and curing behavior of polyimide blends
Author(s) -
Choudhary Veena,
Pearce E. M.
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070511017
Subject(s) - materials science , curing (chemistry) , thermosetting polymer , differential scanning calorimetry , polyimide , composite material , thermogravimetry , thermal stability , isothermal process , thermoplastic , polymerization , polymer chemistry , chemical engineering , polymer , thermodynamics , physics , layer (electronics) , engineering
Blends of thermosetting (Thermid MC‐600 and Thermid FA‐700) and thermoplastic (UL‐TEM 1000) polyimide resins with different compositions were prepared. Curing and thermal behavior of the blends were investigated using differential scanning calorimetry and dynamic thermogravimetry in a nitrogen atmosphere. The peak exotherm temperature increased with increasing amount of thermoplastic resin, whereas the heat of polymerization decreased. The electrical characteristics of the blends were also investigated using a dielectric analyzer. Dynamic as well as isothermal scans were recorded. Ionic conductivity, permittivity, and the loss factor were measured as a function of temperature at various frequencies. These results showed the complete curing of the resins having 50% Ultem at 225°C in 1 h, whereas Thermid MC‐600 required a postcuring step to observe fully cured resins. A marginal decrease in thermal stability was observed on blending. © 1994 John Wiley & Sons, Inc.