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Metallization of polyimide film by wet process
Author(s) -
Ho SyhMing,
Wang TsungHsiung,
Chen HanLung,
Chen KerMing,
Lian SyhMing,
Hung Aina
Publication year - 1994
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1994.070510803
Subject(s) - polyimide , materials science , electroplating , composite material , copper , nickel , adhesion , layer (electronics) , metallurgy
The interfacial adhesion strength of metallized polyimide (BPDA/ODA/PDA) has been studied with respect to polyimide surface molecular structure, reactions during electroless nickel deposition, baking, copper electroplating, and thickness of polyimide film. Each factor is discussed in terms of its influence on the peel strength. For practical application, operation at optimized conditions for each step of the metallization process is essential for sustaining the mechanical integrity of the copper/polyimide laminate. © 1994 John Wiley & Sons, Inc.