Premium
An adhesion study of poly(phenylquinoxaline) on silicon wafers
Author(s) -
Mcgarvey C.,
Beccat P.,
ZanierSzydlowski N.
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070501215
Subject(s) - silane , silanol , wafer , materials science , x ray photoelectron spectroscopy , curing (chemistry) , composite material , coating , silicon , layer (electronics) , adhesion , chemical engineering , chemistry , nanotechnology , organic chemistry , metallurgy , engineering , catalysis
This study is an investigation of the adhesion between poly(phenylquinoxaline) (PPQ) and γ‐aminopropyltriethoxysilane (γ‐APS)‐treated silicon wafers. In order to determine the locus of failure of the PPQ film‐coated wafers, when the coating was mechanically removed from the surface, the surface‐sensitive techniques of X‐ray photoelectron spectroscopy and contact angle measurements were employed. This permitted an analysis of the surface that was exposed when the film was removed from the substrate. In addition, FTIR spectroscopy was used to study the effect of the thermal treatment of the film‐coated wafers on the silane layer. Treatment of the coated wafers up to temperatures in excess of 250°C caused a deterioration of the γ‐APS layer, leading to a loss in adhesion of the coating, which was likely a result of the decrease in the density of the PPQ chains, which become anchored in the silane layer as the silanol groups condense during curing. When treatment temperatures are allowed to reach 400°C, the silane layer becomes severely degraded. It was found that the locus of failure remained the same, regardless of whether or not the coated wafer was subjected to aging in boiling water. © 1993 John Wiley & Sons, Inc.