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Poly( N ‐phenolicmaleimide) for high‐temperature stable near‐UV resist
Author(s) -
Chiang WenYen,
Lu JinYuh
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070500610
Subject(s) - maleimide , resist , swelling , glass transition , thermal stability , polymer chemistry , thermal decomposition , transesterification , materials science , polymerization , decomposition , chemistry , polymer , catalysis , organic chemistry , composite material , layer (electronics)
Poly[ N ‐(4‐hydroxyphenyl)maleimide] (PHPMI) was prepared by the radical polymerization of N ‐(4‐acetoxyphenyl) maleimide, followed by transesterification of the acetoxy group. The cyclic maleimide group was responsible for high‐temperature stabilities. Thus, a high glass transition temperature of 227°C and a thermal decomposition temperature of 417°C were found. PHPMI sensitized by a diazonaphthoquinone or an aromatic bisazide was prepared and evaluated as a positive or a negative near‐UV resist. Microlithographic positive/negative images were obtained that were stable to temperatures higher than 200°C. The developed images showed no pattern deformation induced by swelling during development. © 1993 John Wiley & Sons, Inc.