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Polyethylene fibers‐polyethylene matrix composites: Preparation and physical properties
Author(s) -
Teishev Albert,
Incardona Silvia,
Migliaresi Claudio,
Marom Gad
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070500314
Subject(s) - composite material , materials science , polyethylene , ultimate tensile strength , composite number , fiber , thermal expansion , microstructure , glass fiber , young's modulus , melting point , polymer
Drawing on the difference in melting points of UHMPE fiber (150°C) and HDPE matrix (130°C), single‐polymer composites were fabricated under various processing conditions. Because of the chemical similarity of the composite components, good bonding at the fiber‐matrix interface could be expected. The matrix, the fiber, and unidirectional composite laminae were studied using TMA and DSC analyses, a hot‐stage crystallization unit attached to a polarizing microscope, and an universal tensile testing machine. The TMA showed negative thermal expansion of the fiber over the complete temperature range of the experiment. Three regimes of contraction according to the values of the thermal expansion coefficient were detected. DSC analyses of either the fiber or the composite specimens did not show any appreciable changes after various thermal treatments. They also showed no evidence of fiber relaxation during manufacture, probably because of the pressure‐related transverse constraint. The tensile strength and modulus values of the composite appeared to be fairly high and close to those reported for other composites reinforced with polyethylene (PE) fibers. An apparent maximum on the temperature dependencies of tensile properties was observed. A study of the matrix microstructure did not give any proof of transcrystalline growth at the fiber‐matrix interface even for chemical or plasma surface‐treated fibers. © 1993 John Wiley & Sons, Inc.