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Toughening of epoxy resins by modification with dispersed acrylate rubber for electronic packaging
Author(s) -
Ho TzongHann,
Wang ChunSzhan
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070500311
Subject(s) - epoxy , materials science , composite material , acrylate , glass transition , toughness , natural rubber , dynamic mechanical analysis , elastomer , flexural strength , flexural modulus , monomer , polymer
Dispersed acrylate rubbers were used to improve the toughness of cresol‐formaldehyde Novolac epoxy resin cured with phenolic novolac resin for electronic encapsulation application. The effect of the alkyl group of the acrylate monomer on the phase separation of resultant elastomers from epoxy resin was investigated. The dispersed acrylate rubbers effectively improve the toughness of cured epoxy resins by reducing the coefficient of thermal expansion (CTE) and flexural modulus, while the glass transition temperature ( T g ) was hardly depressed. Electronic devices encapsulated with the dispersed acrylate rubber‐modified epoxy molding compounds have exhibited excellent resistance to the thermal shock cycling test and have resulted in an extended device use life. © 1993 John Wiley & Sons, Inc.