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High performance semi‐interpenetrating polymeric networks based on acetylene‐terminated sulfone. Part I. Cure and thermal characteristics
Author(s) -
Mai Kancheng,
Zeng Hanmin
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070491206
Subject(s) - materials science , acetylene , glass transition , sulfone , oligomer , thermoplastic , composite material , polymer , polymer chemistry , chemistry , organic chemistry
A series of semi‐interpenetrating polymer networks (semi‐IPN) have been prepared from acetylene‐terminated sulfone (ATS‐C) oligomer and high‐performance thermoplastic (TP) blends. The cure characteristics and thermal properties of ATS‐C and semi‐IPNs are presented in this paper. The addition of thermoplastics has no effect on the mechanism of ATS‐C cure reaction and thermal behavior of cured systems. The glass‐transition temperature ( T g ) and heat distorsion temperature (HDT) of thermoplastics are remarkably decreased with adding ATS‐C. The higher the T g and HDT of the thermoplastics, the more obvious the reduction of T g and HDT. In the case of fully cured semi‐IPNs, the T g and HDT value of the TP phase are higher than or equal to the T g and HDT of pure TP. The thermal stabilities of semi‐IPNs decrease as the content of ATS‐C oligomer increases. © 1993 John Wiley & Sons, Inc.