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Thermal conductivities of powder‐filled epoxy resins
Author(s) -
Lin F.,
Bhatia G. S.,
Ford J. D.
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070491105
Subject(s) - epoxy , materials science , composite material , thermal , thermal conductivity , transient (computer programming) , oxide , aluminium , aluminium powder , filler (materials) , thermodynamics , physics , computer science , metallurgy , operating system
Effective thermal conductivities of powder‐filled epoxy composites were experimentally obtained using a transient method. Fillers used were aluminum and cupric oxide. Comparisons of these data with published correlations indicate that Agari's model can give better fits. Nielsen's model may also give a good prediction of the shape of particles can be determined and values of parameters A and ϕm are available. An alternative method of dealing with parameter C 2 in Agari's model is suggested. © 1993 John Wiley & Sons, Inc.
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