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Preparation and properties of Si‐containing copolymer for near‐UV resist. III. Maleimide/silylstyrene copolymer
Author(s) -
Chiang WenYen,
Lu JinYuh
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070490515
Subject(s) - maleimide , copolymer , polymer chemistry , monomer , materials science , glass transition , trimethylsilyl , resist , thermal stability , imide , chemistry , polymer , organic chemistry , nanotechnology , composite material , layer (electronics)
Poly(maleimide‐ alt‐p ‐trimethylsilyl‐α‐methylstyrene) (α‐PMTMMS) and poly(male‐imide‐ alt‐p ‐trimethylsilylstyrene) (PMTMSS) were synthesized for positive/negative near‐UV resists in the containing of diazonaphthoquinone sulfonate (DNS). The electron‐rich styrenic monomers tend to undergo alternating copolymerization with an electron‐poor maleimide monomer. The chain‐stiffening effects of the maleimide and α‐methylstyrene group were responsible for high thermal stabilities. A higher glass transition temperature of 226°C was found in α‐PMTMMS. Lithographic positive/negative images were obtained that were stable to temperatures higher than 200°C. Excellent solubility in aqueous base was observed with PMTMSS at 10.3 wt % silicon content and an oxygen‐plasma etching rate of 1:12 compared to hard‐baked HPR–204. © 1993 John Wiley & Sons, Inc.