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Thermal shock test of IC packages sealed with epoxy molding compounds filled with irregular‐shaped silica particles
Author(s) -
Nakamura Yoshinobu,
Yamaguchi Miho,
Tanaka Atsushi,
Okubo Masayoshi
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070490213
Subject(s) - materials science , epoxy , composite material , thermal shock , molding (decorative) , flexural strength , cracking , fracture toughness
The effect of the filler silica particle size on the properties of integrated circuits (IC) packages sealed with an epoxy molding compound was studied. For this purpose, two kinds of epoxy molding compounds filled with irregular‐shaped silica particles having mean sizes of (A) 16 μm and (B) 5 μm were prepared. The fracture toughness ( K c) of cured A was higher than that of cured B, but the flexural strength of cured A was lower than that of cured B, i.e., cured A and B had opposite physical properties. The thermal shock test was carried out in which IC packages were repeatedly dipped alternately in −65 and 150°C liquids and package cracking was observed. The thermal shock property of the IC package sealed with A was superior to that sealed with B. There was a good relationship between the thermal shock test property and K c value. © 1993 John Wiley & Sons, Inc.