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Die drawing technology of high molecular weight polyethylene
Author(s) -
Lee Y. W.,
Li J. X.
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070490103
Subject(s) - die (integrated circuit) , ultimate tensile strength , modulus , materials science , composite material , polyethylene , young's modulus , section (typography) , computer science , nanotechnology , operating system
A comprehensive investigation of the die drawing technology of a high molecular weight polythylene (HMWPE) rod has been carried out. The effect of draw temperature, draw speed, nominal draw ratio, and exit diameter of the dies has been studied. The oriented HMWPE products were characterized mainly by the determination of the three‐point bend modulus and the tensile strength. The tensile strength and the modulus of the drawn HMWPE rod could reach 700 MPa and 18 GPa, respectively. In addition, it was found that forced cooling at the die exit was essential when drawing billets with large section areas. © 1993 John Wiley & Sons, Inc.