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Effect of imidization temperature on properties of polymide films
Author(s) -
Chen KerMing,
Wang TsungHsiung,
King JinnShing,
Hung Aina
Publication year - 1993
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1993.070480213
Subject(s) - polyimide , materials science , curing (chemistry) , polyamide , composite material , fourier transform infrared spectroscopy , polymer chemistry , chemical engineering , layer (electronics) , engineering
Some mechanical and electrical properties of the BPDA/ODA/PDA polyimide film prepared on mylar followed by various cure schedules have been studied. It has been found by FTIR that the imidization reaches its maximum after a 200°C cure schedule for this polyimide. However, the optimum condition of curing is a 350°C cure schedule. Following this cure schedule, one can obtained a polymide film with good mechanical and electrical properties. © 1993 John Wiley & Sons, Inc.