Effect of imidization temperature on properties of polymide films | Zendy

Chen KerMing | Zendy; Wang TsungHsiung | Zendy; King JinnShing | Zendy; Hung Aina | Zendy

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Effect of imidization temperature on properties of polymide films

Author(s) -

Chen KerMing,

Wang TsungHsiung,

King JinnShing,

Hung Aina

Publication year - 1993

Publication title -

journal of applied polymer science

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.575

H-Index - 166

eISSN - 1097-4628

pISSN - 0021-8995

DOI - 10.1002/app.1993.070480213

Subject(s) - polyimide , materials science , curing (chemistry) , polyamide , composite material , fourier transform infrared spectroscopy , polymer chemistry , chemical engineering , layer (electronics) , engineering

Some mechanical and electrical properties of the BPDA/ODA/PDA polyimide film prepared on mylar followed by various cure schedules have been studied. It has been found by FTIR that the imidization reaches its maximum after a 200°C cure schedule for this polyimide. However, the optimum condition of curing is a 350°C cure schedule. Following this cure schedule, one can obtained a polymide film with good mechanical and electrical properties. © 1993 John Wiley & Sons, Inc.

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