Premium
Interaction of polyamic acids and polyamic esters with copper and substituted polysilsesquioxane copolymers
Author(s) -
Linde H. G.
Publication year - 1992
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1992.070460216
Subject(s) - copper , copolymer , pyromellitic dianhydride , polymer chemistry , diamine , polymer , materials science , chemistry , organic chemistry , polyimide , layer (electronics)
The interactions of biphenyldianhydride– p ‐phenylenediamine (BPDA–PDA) polyamic acid and ester polymers with copper and copper‐treated surfaces containing polysilsesquioxanes formed from 3‐aminopropyltriethoxysilane (APS) (or copolymers of APS and phenyltriethoxysilane) were compared by grazing‐incidence infrared spectroscopy. This investigation of a flexible dianhydride–stiff diamine copolymer compliments earlier work using the stiff dianhydride–flexible diamine polyamic acid and ester of pyromellitic dianhydride–oxydianiline (PMDA–ODA). Results support earlier findings that amic acids form thermally labile salts on copper but esters do not. Further, while APS forms a copper‐interactive film that insulates amic acid/metal interaction, APS–phenylsilsesquioxane copolymers create an interfacial region interactive with both copper and overlying polyamic acid.