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Residual stress in particulate epoxy resin by X‐ray diffraction
Author(s) -
Nishino Takashi,
Airu Xu,
Matsumoto Takeshi,
Matsumoto Kanki,
Nakamae Katsuhiko
Publication year - 1992
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1992.070450713
Subject(s) - residual stress , epoxy , materials science , composite material , ultimate tensile strength , thermal expansion , modulus , stress (linguistics) , volume fraction , diffraction , optics , philosophy , linguistics , physics
Residual stress in particulate epoxy resin was investigated by X‐ray diffraction. Microdeformation of incorporated Al and α‐SiO 2 crystal, which was induced by the residual stress, could be detected as a shift of X‐ray diffraction peak. The residual stress at the interface between the adherend and the particulate epoxy resin was found to decrease with the increase of volume fraction of filler. It was shown that the difference in the thermal expansion coefficients between the adherend and the particulate epoxy resin is much more effective on residual stress than the increment of Young's modulus owing to the incorporation of filler. When epoxy resin was cured on the Al plate, incorporated particles were subjected to a tensile stress; while cured on polytetrafluoroethylene sheet, particles were subjected to a compressive stress. The incorporation of some inorganic particles is considered effective to reduce the residual stress.