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Studies on the adhesion of polyimide coatings on copper foil
Author(s) -
Chen K.M.,
Ho S.M.,
Wang T.H.,
King J.S.,
Chang W.C.,
Cheng R. P.,
Hung A.
Publication year - 1992
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1992.070450602
Subject(s) - polyimide , copper , materials science , foil method , scanning electron microscope , x ray photoelectron spectroscopy , composite material , adhesion , polymer chemistry , layer (electronics) , chemical engineering , metallurgy , engineering
The peel strength and the color of the copper foil peeled at 90 degrees from five different polyimide films were studied. The interfacial surfaces of copper foil and polyimide were examined by scanning electron microscopy (SEM), X‐ray photoelectron spectroscopy (XPS), and energy dispersion analysis by X‐ray (EDAX). There is a correlation between peel strength, and the color of the interfacial side copper caused by oxygen diffusion. Study of the imidization process carried out in vacuum indicates that the geometric arrangements of the atoms of polyimide also play a very important role in peel strength.