Premium
Meta‐bromobiphenol epoxy resins: Applications in electronic packaging and printed circuit board
Author(s) -
Wang ChunShan,
Berman J. R.,
Walker L. L.,
Mendoza A.
Publication year - 1991
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1991.070430713
Subject(s) - epoxy , printed circuit board , materials science , thermal stability , moiety , composite material , phenol , composite epoxy material , electronic packaging , organic chemistry , computer science , chemistry , operating system
Novel 2,2′,6,6′‐tetrabromo‐3,3′,5,5′‐tetramethyl‐4,4′‐biphenol (TBTMBP), and its epoxy derivatives, were synthesized to incorporate the stable meta‐brominated phenol moiety into epoxy resin systems. In electronic encapsulation and laminate applications, epoxy systems derived from TBTMBP have exhibited superior hydrolytic and thermal stability as compared with the conventional ortho‐brominated epoxy resins. These properties have resulted in an extended device life for semiconductors and a high T g with excellent blister resistance for the printed circuit board, while meeting flame retardancy requirements as well.