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The dynamic mechanical analysis of epoxy–copper powder composites using azole compounds as coupling agents
Author(s) -
Ding Jianfu,
Chen Chinmin,
Xue Gi
Publication year - 1991
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1991.070420531
Subject(s) - materials science , epoxy , composite material , copper , dynamic mechanical analysis , azole , composite number , filler (materials) , glass transition , polymer , benzotriazole , coupling (piping) , metallurgy , antifungal , medicine , dermatology
The dynamic mechanical properties of cured epoxy resin have been studied in which copper powder treated or untreated with azole compounds was used as fillers. The untreated fillers do not shift the glass transition temperature of the matrix polymer of the composites, whereas the storage modulus rises with increasing content of fillers. The application of azole compounds as coupling agents, which could react with both copper and epoxy resin, extended the polymer–filler interactions. The composite filled with copper powder treated with benzotriazole shows a strong reinforcement effect and high resistance to moisture.