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Preparation and application of semiconductor–polymer composites
Author(s) -
Miyama Hajime,
Yokoyama Hidekuni,
Nosaka Yoshio
Publication year - 1990
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1990.070410930
Subject(s) - materials science , sulfide , composite number , copper , polymer , nickel , copper sulfide , plating (geology) , composite material , semiconductor , cobalt , chemical engineering , metallurgy , optoelectronics , geophysics , engineering , geology
Copper sulfide–polymer composite was prepared by depositing copper into porous polyolefine film with a method of electroless plating and sulfurizing the copper. The composite was an n‐type semiconductor and useful as a component of p–n junction device and as a gas detector. The method was also useful for the preparation of silver sulfide–, nickel sulfide–, and cobalt sulfide–polymer composites.