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Studies on mechanical properties of polymer composites by X‐ray diffraction. I. Residual stress in epoxy resin by X‐ray diffraction
Author(s) -
Nakamae Katsuhiko,
Nishino Takashi,
Airu Xu,
Matsumoto Takeshi,
Miyamoto Tomoharu
Publication year - 1990
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1990.070401133
Subject(s) - epoxy , materials science , composite material , residual stress , diffraction , stress (linguistics) , ultimate tensile strength , x ray , x ray crystallography , polymer , optics , linguistics , philosophy , physics
Residual stress in epoxy resin cured on Al plate was investigated by X‐ray diffraction. Microdeformation of Al crystal can be detected as a shift of X‐ray diffraction peak induced by the stress resided. Results show that Al plate is subjected to a uniaxial compressive stress of 29 MPa parallel to the adherend surface. In contrast to this, epoxy resin side (embedded particles) was found to be subjected to a uniaxial tensile stress. Experimental data have been compared with the calculated data and that obtained by the bimetallic method. On the basis of results, it is reasonable to conclude that T g is a key factor determining the residual stress, and the difference of thermal expansion coefficients between Al plate and the cured epoxy resin from T g to room temperature causes the residual stress. It has been shown that the X‐ray diffraction method is useful to detect the stress at the interface between resin and adherend in situ and nondestructively.