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Competition between cure and thermal degradation in a high T g epoxy system: Effect of time and temperature of isothermal cure on the glass transition temperature
Author(s) -
Pang K. P.,
Gillham J. K.
Publication year - 1990
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1990.070390411
Subject(s) - glass transition , diglycidyl ether , epoxy , isothermal process , materials science , vitrification , degradation (telecommunications) , composite material , bisphenol a , diamine , work (physics) , polymer chemistry , chemical engineering , thermodynamics , polymer , medicine , telecommunications , physics , computer science , andrology , engineering
The isothermal cure of a diglycidyl ether of bisphenol A with a tetrafunctional aromatic diamine has been studied in an attempt to achieve full cure (maximum glass transition temperature, T g ∞ , ca. 170°C). Since high temperatures of cure are necessary for high T g ∞ systems (because of low reaction rates after vitrification), cure and thermal degradation reactions often compete. In this work T g is used as a direct measure of conversion. An approach leading to a series of iso‐ T g contours in a temperature vs. time transformation (TTT) diagram, which can be used to design time‐temperature cure paths leading to particular values of T g , is discussed.