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Aging and performance of structural film adhesives. III. Effect of humidity on a modern aerospace adhesive
Author(s) -
Ennis B. C.,
Pearce P. J.,
Morris C. E. M.
Publication year - 1989
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1989.070370102
Subject(s) - adhesive , materials science , composite material , softening point , hydrolysis , solubility , polymerization , humidity , relative humidity , softening , epoxy , polymer , shrinkage , chemistry , organic chemistry , physics , layer (electronics) , thermodynamics
The aging of an uncured, DGEBA‐based commercial film adhesive exposed to high humidity at 40°C was monitored by high performance liquid chromatography (HPLC), thermal analysis, solubility, flow, and mechanical testing of joints. DGEBA and brominated DGEBA resins, and representative mixes of these were hydrolyzed in vitro. It is suggested that the major reaction at 40°C is polymerization, which is accelerated by moisture and leads to a crosslinked structure different to that resulting from normal cure. The poorer adhesive performance after aging is mainly the result of reduced resin flow during joint formation, although there is some contribution from the hydrolysis of epoxide groups which leads to lower crosslink density in the cured adhesive. The softening point of the uncured material and T g of the cured material are useful indicators of the quality of this adhesive which, compared to some earlier formulations, has improved resistance to these conditions.