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Decrease in the etch rate of polymers in the oxygen afterglow with increasing gas flow rate
Author(s) -
Lerner N. R.,
Wydeven T.
Publication year - 1988
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1988.070350715
Subject(s) - polybutadiene , polymer , afterglow , materials science , volumetric flow rate , oxygen , analytical chemistry (journal) , double bond , polymer chemistry , degradation (telecommunications) , polymer degradation , chemistry , thermodynamics , composite material , organic chemistry , copolymer , telecommunications , physics , gamma ray burst , astronomy , computer science
In this paper we report the variation of the etch rate of polymers in the afterglow of a radio frequency discharge in oxygen as a function of total flow rate in the range 2–10 cm 3 (STP)/min. The measurements were made at ambient temperature with the O( 3 P) concentration held essentially constant. We report results on three polymers: cis ‐polybutadiene, a polybutadiene with 33% 1,2 double bonds, and a polybutadiene with 40% 1,2 double bonds. We have observed that the etch rate of these polymers decreases significantly with increasing flow rate, strongly suggesting that the vapor‐phase products of polymer degradation contribute to the degradation process.