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Photoacoustic monitoring of adhesive curing
Author(s) -
TorresFilho A.,
Perondi L. F.,
Miranda L. C. M.
Publication year - 1988
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1988.070350109
Subject(s) - adhesive , curing (chemistry) , thermal diffusivity , epoxy , materials science , photoacoustic imaging in biomedicine , polymer , photoacoustic spectroscopy , composite material , thermal , viscosity , thermodynamics , optics , physics , layer (electronics)
Abstract The crosslinking reaction of an epoxy‐based resin has been monitored by observing the time evolution of the thermal diffusivity of the mixture, using photoacoustic spectroscopy. The results are interpreted in terms of the expected thermal properties of liquids, polymers and solids, and a comparison with the reported viscosity behavior in similar systems is also made. The potential of the technique for following the curing process is discussed.