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New epoxy‐imide resins cured with bis(hydroxyphthalimide)s
Author(s) -
Ichino Toshihiro,
Hasuda Yoshonori
Publication year - 1987
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1987.070340425
Subject(s) - epoxy , imide , triethylamine , materials science , adhesive , ultimate tensile strength , composite material , amine gas treating , tertiary amine , catalysis , polymer chemistry , chemistry , organic chemistry , layer (electronics)
New epoxy‐imide resins were synthesized using bis (hydroxyphthalimide)s (BHPIs). Among these resins, that cured with BHPI(DDS), synthesized from 4,4′‐diaminodiphenylsulfone, exhibits the best thermal resistance, reaching a tan δ maximum temperature of 230°C. This resin also features a tensile lap shear adhesive strength of 320 kgf/cm 2 when applied to steel test pieces. The cure reaction was followed by infrared spectroscopy and dynamic mechanical analysis. The ring‐opening reaction between the phenolic hydroxyl group of BHPI and the epoxy group is observed, and accelerated by a tertiary amine catalyst, triethylamine.