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Liquid‐rubber‐modified epoxy adhesives cured with dicyandiamide. II.—Morphology and adhesion strengths
Author(s) -
Lee YuDer,
Wang ShiKwun,
Chin WeiKuo
Publication year - 1987
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1987.070330637
Subject(s) - chin , engineering , library science , medicine , computer science , anatomy
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