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Laser interferometric measurement of polymer thin film thickness changes during processing
Author(s) -
Saenger Katherine L.,
Tong HoMing
Publication year - 1987
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1987.070330529
Subject(s) - polyimide , materials science , interferometry , refractive index , polymer , laser , composite material , thin film , optics , thermal expansion , optoelectronics , nanotechnology , physics , layer (electronics)
A simple interferometric technique is described for monitoring thickness changes in solution‐cast polymer films as they are dried and cured. This paper follows a freshly spun solution of polyamic acid in NMP as it is converted into a cured polyimide film of 6 μm in thickness. The technique is shown to be nearly quantitative despite the effects of thermal expansion and cure‐related refractive index changes.