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Effect of silicon comonomers on thermal degradation of polystyrene
Author(s) -
Gupta D. C.,
Sharma R. C.
Publication year - 1985
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1985.070301107
Subject(s) - copolymer , styrene , polystyrene , materials science , siloxane , comonomer , differential scanning calorimetry , polymer chemistry , silane , glass transition , thermal decomposition , thermogravimetry , chemical engineering , composite material , polymer , chemistry , organic chemistry , engineering , physics , thermodynamics
The thermal degradation of the following organosilicon copolymers: styrene–vinylmethyl‐diacetoxysilane, styrene‐2‐methacryloyloxypropoxytrimethyl silane, styrene–(dimethyl) siloxane–methylvinylsiloxane) diol and hexamethyl cyclotrisiloxane–styrene–hexamethyl cyclotrisiloxane was investigated. The techniques of thermogravimetry, thermomechanical analysis, and differential scanning calorimetry (DSC) were used. The initial decomposition temperature for all the copolymers except styrene–siloxane block copolymers was less than that for polystyrene irrespective of the nature of the silicon comonomer. Integral procedural decomposition temperature of copolymers was higher than that for polystyrene except styrene‐2‐methacryloyloxy propoxytrimethyl silane copolymers which were showing lower (IPDT) values. Styrene–siloxane copolymers were found to be most thermally stable. Variation in the glass transition temperature and probe displacement under stress is related to the polarity of the silicon moiety in the styrene copolymers.