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A new method of evaluation of the effect of electron beam and developing process on positive polymeric resists
Author(s) -
Pelzbauer Z.,
Wagner R.
Publication year - 1984
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1984.070290435
Subject(s) - resist , materials science , cathode ray , polymer , scanning electron microscope , latent image , beam (structure) , characterization (materials science) , electron microscope , composite material , electron , nanotechnology , optics , computer science , physics , image (mathematics) , layer (electronics) , quantum mechanics , artificial intelligence
A new method of evalution of the effect of electron beam on the latent changes in degrading polymer resists has been developed on the base of measurement of the developing curve under an interference microscope. An evalution procedure using the unit parameters (film thickness and development time) has been suggested for the characterization of the sensitivity and contrast of resists.