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Dielectric loss behavior of cross‐linked polyethylene and analog materials
Author(s) -
Jang Y. T.,
Phillips P. J.
Publication year - 1983
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1983.070280319
Subject(s) - materials science , polyethylene , dielectric loss , dielectric , composite material , polymer , curing (chemistry) , atmospheric temperature range , loss factor , polymer chemistry , thermodynamics , physics , optoelectronics
The dielectric loss behavior of crosslinked polyethylene has been determined over the frequency range 10–5 kHz and over the temperature range −150 to 100°C. Major loss effects occur at the lower temperatures and are caused by libration of the organic byproducts of the crosslinking agent, dicumyl peroxide. Analog materials prepared from linear low density polyethylene by blending in of either acetophenone or 2‐phenyl‐2‐propanol confirm the hypothesis. The effects of concentration of by products and of orientation of the polymer have been studied. Activation energy analyses suggest that room temperature losses will occur in the microwave region. The behavior is significantly affected by curing with steam, typical loss peaks being an order of magnitude lower than for dry cured specimens. A new loss region appears close to but below, 0°C.