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Cure kinetics of a low epoxide/hydroxyl group‐ratio bisphenol a epoxy resin–anhydride system by infrared absorption spectroscopy
Author(s) -
Stevens Gary C.
Publication year - 1981
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1981.070261225
Subject(s) - epoxide , phthalic anhydride , bisphenol a , epoxy , infrared spectroscopy , chemistry , curing (chemistry) , kinetics , polymer chemistry , reaction mechanism , photochemistry , chemical kinetics , acid anhydride , organic chemistry , catalysis , physics , quantum mechanics
An infrared absorption spectroscopy study of the curing kinetics of a low (1.12) epoxide/hydroxyl‐group ratio bisphenol A epoxy resin—phthalic anhydride system is reported. A full infrared peak assignment to molecular vibrational modes is given for the range 400 to 4000 cm −1 , and the optical density behavior of all peaks during reaction is discussed in detail. Proposed rival reaction mechanisms are considered and their respective kinetic behavior discussed. The reaction was found to follow consecutive‐step addition esterification and simultaneous addition etherification, and epoxide—hydroxyl group and carboxylic acid dimer hydrogen bonding was found to occur. The reaction behavior supports a proposed hydroxyl group‐limited inhomogeneous bulk reaction mechanism of a colloid type.