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Manufacture of ultrahigh‐modulus poly(oxymethylenes) by die drawing
Author(s) -
Hope P. S.,
Richardson A.,
Ward I. M.
Publication year - 1981
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1981.070260905
Subject(s) - die (integrated circuit) , materials science , extrusion , composite material , modulus , rod , void (composites) , young's modulus , hydrostatic equilibrium , copolymer , polymer , nanotechnology , medicine , alternative medicine , physics , pathology , quantum mechanics
Abstract A stable experimental die drawing process has been operated for poly(oxymethylene) over a range of temperature. Rods possessing room‐temperature Young's moduli up to 23 GPa were produced using a homopolymer grade, the values obtained from a copolymer being somewhat lower. This compares favorably with the best modulus achieved by hydrostatic extrusion but is rather lower than that produced by conventional drawing; reasons for this are discussed. A stable die drawing process has also been operated for glass fiber‐reinforced poly(oxymethylene), but extensive macroscopic void formation occurred in the products under all conditions, reducing their potential for practical application.