Premium
New acetylene‐terminated phenylquinoxaline oligomers
Author(s) -
Hedberg F. L.,
Arnold F. E.
Publication year - 1979
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1979.070240313
Subject(s) - materials science , acetylene , diacetylene , adhesive , amorphous solid , polymer chemistry , polymer science , polymerization , benzil , polymer , thermal stability , softening , chemical engineering , composite material , organic chemistry , chemistry , catalysis , layer (electronics) , engineering
A series of new acetylene‐terminated phenylquinoxaline oligomers and diacetylene compounds have been prepared utilizing 4‐(3‐ethynylphenoxy)benzil. The amorphous materials with molecular weights from 500 to 1460 exhibited softening in the 25–160°C range with a strong polymerization exotherm reaching a maximum at 270–290°C. The addition nonvolatile cure provides materials which show excellent thermoxidative stability and processability for high‐temperature matrix and adhesive resins.