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Effect of fillers on kinetics of epoxy cure
Author(s) -
Dutta A.,
Ryan M. E.
Publication year - 1979
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1979.070240302
Subject(s) - epoxy , curing (chemistry) , differential scanning calorimetry , filler (materials) , materials science , kinetics , yield (engineering) , composite material , thermodynamics , physics , quantum mechanics
The effect of fillers on the reaction of liquid epoxy systems cured with m ‐phenylenediamine has been studied within the temperature range 70–170°C using a Perkin–Elmer differential scanning calorimeter. Quantitative studies have been made with regard to the effect of filler on the kinetics of cure. Mathematical expressions have been devised to describe the curing reaction as a function of time, temperature, and filler content. These kinetic expressions were found to yield results which were in good agreement with the experimental data for the two fillers studied.