Premium
Diluted epoxy adhesives II. Relationship of shrinkage during cure to lap shear strengths
Author(s) -
Dearlove T. J.,
Ulicny J. C.
Publication year - 1978
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1978.070220911
Subject(s) - shrinkage , epoxy , adhesive , materials science , composite material , diethylenetriamine , diglycidyl ether , curing (chemistry) , ether , triethylenetetramine , chemistry , layer (electronics) , organic chemistry , bisphenol a
The shrinkage of a series of epoxy adhesives diluted with either phenyl glycidyl ether (PGE) or 1,4‐butanediol diglycidyl ether (BDE) and cured with either diethylenetriamine (DTA) or diethylaminopropylamine (DPA) was measured and compared with the steel‐to‐steel lap shear strength obtained with these adhesives. It was found that the adhesives with the highest level of shrinkage also gave the highest strengths. Samples cured initially at room temperature with DPA underwent a significant expansion when postcured at elevated temperatures. The amount of shrinkage was found not to be dependent on sample size.