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Adhesion of kevlar aramid cords to rubber
Author(s) -
Iyengar Y.
Publication year - 1978
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1978.070220317
Subject(s) - aramid , materials science , composite material , adhesive , neoprene , natural rubber , epoxy , curing (chemistry) , adhesion , kevlar , fiber , layer (electronics)
Abstract Adhesion development to Kevlar aramid yarn is discussed in relation to polymer characteristics and parameters of molecular structure that determine specific or entropic interactions with adhesives. The effects of rubber compounding variables on adhesion of Kevlar tire cords treated with epoxy/RFL adhesives were determined using the single‐cord pull‐out and 2‐ply peel adhesion tests, which differ in sensitivity to physical properties (stiffness) of the rubber compound. Kevlar adhesion was unaffected by changes in the curing system (e.g., sulfur level, type of sulfenamide accelerator) used in a high‐modulus tire belt compound. Methylene donor/acceptor‐type bonding agents in the compound improved the adhesion initially and after exposure of dipped cords to ozone. RFL modifications (e.g., use of preformed versus in situ RF resins) improved adhesion. Effects of rubber compounds and adhesive on adhesion are discussed in relation to their chemical and physical characteristics. Lastly, two types of adhesive systems were developed for bonding Kevlar to high‐modulus nitrile and neoprene compounds used in hoses. The simple system involves curing an aqueous epoxy dip and then applying an air‐drying, solvent‐based cement (polyisocyanate). The other consists of curing two aqueous dips (epoxy/RFL with latex modification).