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Thermal analysis of thermosetting phenolic compounds for injection molding
Author(s) -
Siegmann A.,
Narkis M.
Publication year - 1977
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1977.070210903
Subject(s) - thermosetting polymer , curing (chemistry) , differential scanning calorimetry , materials science , activation energy , glass transition , composite material , kinetics , thermal , thermal analysis , polymer , thermodynamics , chemistry , organic chemistry , physics , quantum mechanics
The differential scanning calorimetry technique has been applied to investigate the curing of injection molding phenolic compounds. The data obtained include degree of cure, rate of curing, and heats and temperatures of curing as function of various heating rates, rate constants, energy of activation, and glass transition temperature. The curing temperature and heating rate were found to affect both the curing reaction kinetics and the final structure of the crosslinked network. The glass transition temperature changes continously with the extent of curing, approaching the cure temperature.