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Relations between solder dip resistance and moisture permeability of printed circuit adhesives
Author(s) -
Namiki Isamu
Publication year - 1976
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1976.070200720
Subject(s) - materials science , composite material , adhesive , soldering , epoxy , permeability (electromagnetism) , moisture , chemistry , layer (electronics) , biochemistry , membrane
By measuring moisture permeability constants of printed circuit adhesive films having different solder dip resistances, a study was made of the relation between moisture permeability and solder dip resistances. Comparisons of poly(vinylbutyral) (I)–phenolic resin with I–epoxy resin, I–phenolic resin with poly(vinyl acetate)–phenolic resin, I–phenolic resin with poly(vinylformal)–phenolic resin and study of the effect of hydroxyl group content of I show that adhesive films of good solder dip resistance have small moisture permeability. The solder dip resistance depends markedly on the mole ratio of formaldehyde–phenol in the phenolic resin, while the moisture permeability is almost independent of the ratio.