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Effect of surface exposure time on bonds to aluminum
Author(s) -
Levi David W.,
Tanner William C.,
Ross Marie C.,
Wegman Raymond F.,
Bodnar Michael J.
Publication year - 1976
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1976.070200606
Subject(s) - aluminium , materials science , bond strength , degreasing , weibull distribution , composite material , adhesive , bond , bonding strength , metallurgy , layer (electronics) , mathematics , statistics , finance , economics
Lap joints with AF‐126 adhesive were prepared from surfaces of 2024‐T3, 2024‐T3 alclad, and 6061‐T4 aluminum alloys treated by either FPL etch, sandblasting, or vapor degreasing. The strength data were described by a two‐parameter Weibull distribution. Allowing between 1 hr and 30 days to elapse between surface preparation and actual bonding had no appreciable effect on bond strength. This was true for all three alloys surface treated in each of the three ways as well as for bonds either tested at ambient conditions or aged for 30 days at 120°F and 95% R.H. 2024‐T3 aluminum, both bare and alclad, formed bonds that showed better strength than 6061‐T4 aluminum.