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Changes in the CN group infrared absorption of dicyandiamide in the presence of moisture
Author(s) -
Fountain Roger,
Haas Thomas W.
Publication year - 1975
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1975.070190724
Subject(s) - absorbance , adhesive , stoichiometry , analytical chemistry (journal) , infrared spectroscopy , infrared , absorption of water , epoxy , materials science , moisture , absorption (acoustics) , chemistry , composite material , chromatography , organic chemistry , optics , physics , layer (electronics)
A correlation between lap shear bond strength and an infrared absorbance ratio of reactive groups in a commercial dicyandiamide (dicy.)‐cured epoxy adhesive was explained by the presence of a hidden factor in the nitrile absorbance measurement of the dicyandiamide. The absorbance at 2210 cm −1 due to the CN of the dicy. was the denominator of the absorbance ratio in the correlation. Water present in the adhesive changed the two infrared absorptions in the 2200 cm −1 region of the spectrum resulting in a lower 2210 cm −1 absorbance than expected stoichiometrically for high (0.4%) water concentrations in the adhesive.