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The thermal degradation of model compounds of amine‐cured epoxide resins. II. The thermal degradation of 1,3‐diphenoxypropan‐2‐ol and 1,3‐diphenoxypropene
Author(s) -
PatersonJones J. C.,
Percy V. A.,
Giles R. G. F.,
Stephen A. M.
Publication year - 1973
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1973.070170620
Subject(s) - epoxide , degradation (telecommunications) , thermal stability , bisphenol a , amine gas treating , inert gas , thermal , chemistry , inert , materials science , organic chemistry , bisphenol , polymer chemistry , epoxy , catalysis , telecommunications , physics , meteorology , computer science
Abstract The thermal degradations in an inert atmosphere, in air, and over alumina of 1,3‐diphenoxypropan‐2‐ol and 1,3‐diphenoxypropene were studied with the aim of investigating the thermal stability of the glyceryl portion of bisphenol A‐based epoxide resins. Degradation products were characterized. The thermal stability of the glyceryl group relative to that of the cure linkage in aromatic amine‐cured epoxide resins is discussed.