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The thermal degradation of model compounds of amine‐cured epoxide resins. I. The thermal degradation of 1‐(N‐ethylanilino)‐3‐phenoxypropan‐2‐ol
Author(s) -
PatersonJones J. C.,
Percy V. A.,
Giles R. G. F.,
Stephen A. M.
Publication year - 1973
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1973.070170619
Subject(s) - degradation (telecommunications) , epoxide , thermal stability , amine gas treating , inert gas , bisphenol a , thermal , materials science , inert , chemistry , organic chemistry , chemical engineering , polymer chemistry , epoxy , catalysis , telecommunications , physics , engineering , meteorology , computer science
The thermal degradations of 1‐(N‐ethylanilino)‐3‐phenoxypropan‐2‐ol in an inert atmosphere, in air, and over alumina were studied with the aim of investigating the thermal stability of the cure linkage in aromatic amine‐cured bisphenol A‐based epoxide resins. Degradation products were characterized. Possible degradation mechanisms are outlined and are related to the results of previous studies of the thermal degradation of these resins.