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The chemistry of fast‐curing phenolic adhesives. II
Author(s) -
Tiedeman G. T.,
Sanclemente M. R.,
Smith H. A.
Publication year - 1973
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1973.070170615
Subject(s) - curing (chemistry) , formaldehyde , amine gas treating , phenol , hydroxymethyl , adhesive , chemistry , polymer chemistry , organic chemistry , aromatic amine , layer (electronics)
Abstract Novolak‐like materials have been prepared by reaction of phenol–formaldehyde resoles with aromatic amines. The hydroxymethyl groups present in resoles react with the ring carbons and the amino groups of the aromatic amine. Proportions of the two types of product vary with the amine used.