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The chemistry of fast‐curing phenolic adhesives. I
Author(s) -
Tiedeman G. T.,
Sanclemente M. R.
Publication year - 1973
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1973.070170614
Subject(s) - adhesive , curing (chemistry) , formaldehyde , durability , phenol , polymer , materials science , reactivity (psychology) , phenols , organic chemistry , polymer chemistry , polymer science , chemistry , composite material , chemical engineering , layer (electronics) , medicine , alternative medicine , pathology , engineering
Certain low molecular weight, resinous polymers, such as those derived from phenol and formaldehyde, may be chemically modified with aromatic amines to produce other resins of physical properties similar to those of the original resins, but with chemical reactivity which is orders of magnitude faster than that of the unmodified resins. This means that while an ordinary phenolic adhesive cures in minutes at high temperature, a properly modified phenolic can be advanced in seconds at ambient conditions to a cured resin of strength and durability comparable to those of ordinary phenolic adhesives.