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A new apparatus for continuously monitoring the deformation of a thermoplastic material
Author(s) -
Martinelli F. J.,
Hodgkin J. H.
Publication year - 1973
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1973.070170511
Subject(s) - thermosetting polymer , thermoplastic , materials science , composite material , deformation (meteorology) , thermal , thermoplastic elastomer , polymer , thermodynamics , physics , copolymer
A new apparatus is described whereby the thermal behavior, including the deformation temperature, of a thermoplastic material may be obtained. The apparatus is intended to replace ASTM procedure No. D648‐56 and has several advantages over that procedure. Thermal behavior of several common thermoplastics under two different stresses and for three different heating rates is described. An application to the determination of optimum cure times for certain thermosetting epoxides is also described.