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Studies on tack of pressure‐sensitive adhesive tapes: On the surface contamination by adhesive mass after peeling
Author(s) -
Toyama M.,
Ito T.,
Moriguchi H.
Publication year - 1970
Publication title -
journal of applied polymer science
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.575
H-Index - 166
eISSN - 1097-4628
pISSN - 0021-8995
DOI - 10.1002/app.1970.070140909
Subject(s) - adhesive , materials science , composite material , pressure sensitive , viscoelasticity , surface tension , adhesive bonding , surface energy , layer (electronics) , physics , quantum mechanics
The presence of adhesive residue on the surface of various adherends after peeling has been confirmed using a tracer technique. Adhesive bonding is found to break by a cohesive mechanism, although the unbonding process seems apparently to be due to intersurface failure. This result supports the concept for adhesive bond breaking proposed in the preceding paper: The unbonding proceeds from the viscoelastic deformation of the adhesive mass around the wetted spots on the surface. As the number of spots in a unit area is controlled by surface energy, the tack value is dependent on the critical surface tension of the adherends.